LB Semicon, Inc. LB Semicon, Inc.

LB Semicon, Inc.

061970

株式のランク #19173
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
株価
$2.31
時価総額
$161.86M
変化（1日）
1.21%
変化（1年）
-37.84%
国
KR
取引 LB Semicon, Inc. (061970)

カテゴリー

Technology
LB Semicon, Inc.（061970）の株式分割履歴
LB Semicon, Inc.株（シンボル：061970）は合計で0回の株式分割を実施しました。
最新の株式分割はOct 21, 2026に行われました。
Oct 21, 2026より前に購入された061970株は、現在0061970株に相当します。
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