LB Semicon, Inc.
061970
株式のランク
#19181
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
株価
$2.32
時価総額
$162.58M
変化（1日）
1.67%
変化（1年）
-37.56%
国
KR
取引 LB Semicon, Inc. (061970)
カテゴリー
Technology
LB Semicon, Inc.（061970）のP/S比率
2026 時点のP/S比率 TTM: 0
LB Semicon, Inc. の最新の財務報告および株価によると、現在のP/S比率（TTM）は 0 です。2026 年末時点でのP/S比率は 0 でした。
LB Semicon, Inc. の P/S 比率の履歴（2026 ～ 2026）
各年末時点のP/S比率
| 年 | P/S比率 | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
同業他社のP/S比率
| 企業 | P/S比率 | P/S比率の差 | 国 |
|---|---|---|---|
| 17.60 | - |
US
|
|
| 14.25 | - |
TW
|
|
| 18.55 | - |
US
|
|
| 7.75 | - |
US
|
|
| 22.53 | - |
US
|
