LB Semicon, Inc.
061970
株式のランク
#18889
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
株価
$2.37
時価総額
$166.07M
変化（1日）
2.60%
変化（1年）
-36.00%
国
KR
取引 LB Semicon, Inc. (061970)
カテゴリー
Technology
LB Semicon, Inc.（061970）の株価履歴
終値の最高値: $2.80 （2026-10-01）
終値の最安値: $4.06 （2011-01-01）
終値の最安値: $4.06 （2011-01-01）
LB Semicon, Inc. の株価履歴（2011 ～ 2026）
年間株価パフォーマンス
| 年 | パフォーマンス |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
類似企業または競合の株価
| 企業 | 株価 | 変化率 1年% | 国 |
|---|---|---|---|
| $212.87 | 18.08% |
US
|
|
| $73.94 | 55.79% |
TW
|
|
| $324.90 | -4.53% |
US
|
|
| $865.46 | 336.07% |
US
|
|
| $511.84 | 122.32% |
US
|
