LB Semicon, Inc.
061970
株式のランク
#18922
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
株価
$2.26
時価総額
$158.71M
変化（1日）
-6.70%
変化（1年）
-41.29%
国
KR
取引 LB Semicon, Inc. (061970)
カテゴリー
Technology
LB Semicon, Inc.（061970）のEPS
2026 時点のEPS TTM: 0
LB Semicon, Inc.の最新の財務報告と株価によると、同社の現在のEPS（TTM）は0です。2026年末には、EPSは0で、2026年のEPS0と同等でした。
LB Semicon, Inc.のEPS履歴（2026から2026まで）
各年末時点のEPS
| 年 | EPS | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
同様の企業または競合他社のEPS
| 企業 | EPS | EPSの差 | 国 |
|---|---|---|---|
| $7.95 | - |
US
|
|
| $2.74 | - |
TW
|
|
| $8.06 | - |
US
|
|
| $75.31 | - |
US
|
|
| $3.94 | - |
US
|
