LB Semicon, Inc.
061970
株式のランク
#19240
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
株価
$2.28
時価総額
$159.92M
変化（1日）
-5.98%
変化（1年）
-40.84%
国
KR
取引 LB Semicon, Inc. (061970)
カテゴリー
Technology
LB Semicon, Inc.（061970）の配当利回りの履歴
LB Semicon, Inc.（銘柄コード: 061970）の配当利回り（TTM）は2026時点で0です。
過去5年間の平均配当利回り: 0.00%
過去5年間の平均配当利回り: 0.00%
LB Semicon, Inc.（061970）の2026から2026までの配当利回りの履歴
各年末時点の配当利回り（TTM）
| 年 | 配当利回り | 変化 |
|---|---|---|
| 提供された日付のデータは十分ではありません。 | ||
類似企業または競合他社の配当利回り（TTM）
| 企業 | 配当利回り | 国 |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
