LB Semicon, Inc.
061970
株式のランク
#19273
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
株価
$2.31
時価総額
$161.61M
変化（1日）
-4.99%
変化（1年）
-40.21%
国
KR
取引 LB Semicon, Inc. (061970)
カテゴリー
Technology
の時価総額 LB Semicon, Inc.(061970)
時価総額: $161.61M
October 2026時点で、LB Semicon, Inc. の時価総額は $161.61M です。これは、当社のデータによると、LB Semicon, Inc. が世界で19273rd番目に価値のある企業であることを意味します。時価総額は、上場企業の発行済株式の総市場価値であり、企業の価値を測るためによく使用されます。
LB Semicon, Inc. の時価総額の履歴（2011 から 2026 まで）
