Amkor Technology, Inc.
AMKR
Classifica tra le azioni
#1993
Amkor Technology, Inc. operates internationally, delivering external... Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Prezzo delle azioni
$42.19
Ultima sincronizzazione: 2026-10-19
Capitalizzazione di mercato
$10.48B
Variazione (1 giorno)
0.88%
Variazione (1 anno)
30.70%
Paese
US
Scambia Amkor Technology, Inc. (AMKR)
Categoria
Technology
Numero di azioni in circolazione per Amkor Technology, Inc. (AMKR)
Numero di azioni in circolazione al June 2026: 247.55M
Secondo gli ultimi rapporti finanziari e il prezzo delle azioni di Amkor Technology, Inc., il numero attuale di azioni in circolazione è 247.55M. Alla fine del December 2024, la società aveva 246.48M azioni in circolazione. Il numero di azioni in circolazione è solitamente influenzato da split azionari e riacquisti.
Storico delle azioni in circolazione di Amkor Technology, Inc. (AMKR) dal 2000 al 2026
Azioni in circolazione alla fine di ogni anno
| Anno | Azioni in circolazione | Cambia |
|---|---|---|
| 2026 (TTM) | 247.55M | 0.16% |
| 2025 | 247.16M | 0.28% |
| 2024 | 246.48M | 0.35% |
| 2023 | 245.63M | 0.39% |
| 2022 | 244.68M | 0.33% |
| 2021 | 243.88M | 0.98% |
| 2020 | 241.51M | 0.74% |
| 2019 | 239.73M | 0.17% |
| 2018 | 239.33M | 0.16% |
| 2017 | 238.94M | 0.64% |
| 2016 | 237.42M | 0.24% |
| 2015 | 236.85M | 2.66% |
| 2014 | 230.71M | 23.35% |
| 2013 | 187.03M | 16.82% |
| 2012 | 160.11M | -16.10% |
| 2011 | 190.83M | 4.10% |
| 2010 | 183.31M | 0.13% |
| 2009 | 183.07M | 0.18% |
| 2008 | 182.73M | 1.18% |
| 2007 | 180.60M | 1.64% |
| 2006 | 177.68M | 0.74% |
| 2005 | 176.39M | 0.59% |
| 2004 | 175.34M | 4.91% |
| 2003 | 167.14M | 1.84% |
| 2002 | 164.12M | 4.46% |
| 2001 | 157.11M | 7.75% |
| 2000 | 145.81M | 0.00% |
Azioni in circolazione per aziende simili o concorrenti
| Azienda | Azioni in circolazione | Differenza | Il paese |
|---|---|---|---|
| 24.19B | 9,671.76% |
US
|
|
| 25.93B | 10,374.56% |
TW
|
|
| 4.77B | 1,825.27% |
US
|
|
| 1.13B | 356.47% |
US
|
|
| 1.63B | 558.86% |
US
|
