Hwatsing Technology Co., Ltd. Hwatsing Technology Co., Ltd.

Hwatsing Technology Co., Ltd.

688120

Classifica tra le azioni #1376
Hwatsing Technology Co., Ltd. engages in the research, development, production,... Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Prezzo delle azioni
$31.17
Capitalizzazione di mercato
$15.94B
Variazione (1 giorno)
-3.19%
Variazione (1 anno)
119.50%
Paese
CN
Scambia Hwatsing Technology Co., Ltd. (688120)

Categoria

Technology
Storico dividendi per Hwatsing Technology Co., Ltd. (688120)
Hwatsing Technology Co., Ltd. (simbolo azionario: 688120) ha effettuato un totale di 4 pagamenti di dividendi.
La somma totale dei dividendi (rettificata per split azionari) è: $1.09
Rendimento da dividendo (TTM): 0.0019
Pagamenti dei dividendi per Hwatsing Technology Co., Ltd. (688120) dal 2023 al 2026
Pagamenti annuali dei dividendi
Anno Dividendo (rettificato per split azionari) Cambia
2026 (TTM) $0.4 51.69%
2025 $0.2637 0.00%
2024 $0.2637 63.89%
2023 $0.1609 0.00%
Elenco di tutti i pagamenti di dividendi
Anno Dividendo Cambia
2026 (TTM) $0.56 51.72%
2025 $0.3691 0.00%
2024 $0.3691 63.90%
2023 $0.2252 0.00%
Dividendi di aziende simili o concorrenti