Chipbond Technology Corporation
6147
Classifica tra le azioni
#3490
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Prezzo delle azioni
$6.63
Capitalizzazione di mercato
$4.94B
Variazione (1 giorno)
0.24%
Variazione (1 anno)
254.50%
Paese
TW
Scambia Chipbond Technology Corporation (6147)
Categoria
Technology
Numero di azioni in circolazione per Chipbond Technology Corporation (6147)
Numero di azioni in circolazione al June 2026: 741.76M
Secondo gli ultimi rapporti finanziari e il prezzo delle azioni di Chipbond Technology Corporation, il numero attuale di azioni in circolazione è 741.76M. Alla fine del December 2023, la società aveva 738.38M azioni in circolazione. Il numero di azioni in circolazione è solitamente influenzato da split azionari e riacquisti.
Storico delle azioni in circolazione di Chipbond Technology Corporation (6147) dal 2006 al 2026
Azioni in circolazione alla fine di ogni anno
| Anno | Azioni in circolazione | Cambia |
|---|---|---|
| 2026 (TTM) | 741.76M | 0.32% |
| 2024 | 739.42M | 0.14% |
| 2023 | 738.38M | -0.04% |
| 2022 | 738.68M | 8.31% |
| 2021 | 682.01M | 4.43% |
| 2020 | 653.07M | 0.27% |
| 2019 | 651.34M | 0.23% |
| 2018 | 649.84M | 0.09% |
| 2017 | 649.26M | 0.00% |
| 2016 | 649.26M | 0.30% |
| 2015 | 647.31M | 0.31% |
| 2014 | 645.31M | 6.79% |
| 2013 | 604.31M | 2.58% |
| 2012 | 589.09M | -0.37% |
| 2011 | 591.26M | 13.05% |
| 2010 | 523.02M | 66.82% |
| 2009 | 313.52M | -1.63% |
| 2008 | 318.70M | -0.58% |
| 2007 | 320.56M | 4.69% |
| 2006 | 306.22M | 0.00% |
Azioni in circolazione per aziende simili o concorrenti
| Azienda | Azioni in circolazione | Differenza | Il paese |
|---|---|---|---|
| 24.19B | 3,161.15% |
US
|
|
| 25.93B | 3,395.69% |
TW
|
|
| 4.77B | 542.52% |
US
|
|
| 1.13B | 52.34% |
US
|
|
| 1.63B | 119.88% |
US
|
