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Tema
Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Classifica tra le azioni #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Prezzo delle azioni
$0.48016532
Ultima sincronizzazione: 2026-08-21
Capitalizzazione di mercato
$87.70M
Variazione (1 giorno)
1.34%
Variazione (1 anno)
11.79%
Paese
TW
Scambia Taiwan IC Packaging Corporation (3372)

Categoria

Technology
Storico del rendimento da dividendi per Taiwan IC Packaging Corporation (3372)
Il rendimento da dividendi (TTM) di Taiwan IC Packaging Corporation (simbolo azionario: 3372) al 2026 è: 0
Rendimento medio negli ultimi 5 anni: 0.00%
Storico del rendimento da dividendi per Taiwan IC Packaging Corporation (3372) da 2026 a 2026
Rendimento da dividendi alla fine di ogni anno (TTM)
Anno Rendimento da dividendi Cambia
Non abbastanza dati per le date fornite.
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