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Winstek Semiconductor Co., Ltd. Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd.

3265
Classifica tra le azioni #10622
Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers... Winstek Semiconductor Co., Ltd., along with its various subsidiaries, offers extensive services in Taiwan, specializing in integrated circuit (IC) testing, wafer bumping, and wafer packaging. Their comprehensive test division provides initial wafer sorting, thorough final and post-production testing, dedicated engineering assistance, and access to advanced test platforms. For wafer bumping, the company delivers a diverse range of solutions, including copper pillar bumps, wafer-level chip scale packaging (WLCSP), lead-free options, plating bump/ball drop/RDL, 6S protection, heterogeneous bumps, and backside metallization. Furthermore, Winstek provides crucial backend services such as die processing, wafer thinning, singulation, and flip-chip integration. They also conduct detailed verification and analysis, which includes failure analysis and reliability assessments. Established in 2000, the company was initially known as Stats ChipPac Taiwan Semiconductor Corp. before officially rebranding to Winstek Semiconductor Co., Ltd. in June 2015. Its main operations are based in Hsinchu City, Taiwan, and it operates as an affiliate of SIGWIN Corporation.
Prezzo delle azioni
$5.93
Ultima sincronizzazione: 2026-08-28
Capitalizzazione di mercato
$808.10M
Variazione (1 giorno)
5.67%
Variazione (1 anno)
76.93%
Paese
TW
Scambia Winstek Semiconductor Co., Ltd. (3265)

Categoria

Technology
Cronologia dei frazionamenti azionari per Winstek Semiconductor Co., Ltd. (3265)
L’azione Winstek Semiconductor Co., Ltd. (simbolo: 3265) ha subito un totale di 0 frazionamenti.
L’ultimo frazionamento è avvenuto il Aug 30, 2026.
Una quota di 3265 acquistata prima di Aug 30, 2026 equivale oggi a 0 quote di 3265.
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Anno Frazionamento Moltiplicatore Moltiplicatore cumulativo
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