Kinsus Interconnect Technology Corp.
3189
Classifica tra le azioni
#1334
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Prezzo delle azioni
$31.96
Capitalizzazione di mercato
$16.84B
Variazione (1 giorno)
6.35%
Variazione (1 anno)
554.04%
Paese
TW
Scambia Kinsus Interconnect Technology Corp. (3189)
Categoria
Technology
Cronologia dei frazionamenti azionari per Kinsus Interconnect Technology Corp. (3189)
L’azione Kinsus Interconnect Technology Corp. (simbolo: 3189) ha subito un totale di 4 frazionamenti.
L’ultimo frazionamento è avvenuto il Jul 24, 2007.
Una quota di 3189 acquistata prima di Jul 25, 2005 equivale oggi a 1.46107281408 quote di 3189.
L’ultimo frazionamento è avvenuto il Jul 24, 2007.
Una quota di 3189 acquistata prima di Jul 25, 2005 equivale oggi a 1.46107281408 quote di 3189.
Elenco dei frazionamenti azionari
| Anno | Frazionamento | Moltiplicatore | Moltiplicatore cumulativo |
|---|---|---|---|
| 2007-07-24 | 11:10 | x1.1 | x1.46107281408 |
| 2006-08-02 | 140991:125000 | x1.127928 | x1.3282480128 |
| 2006-04-11 | 128:125 | x1.024 | x1.1776 |
| 2005-07-25 | 23:20 | x1.15 | x1.15 |
Frazionamenti azionari di aziende simili o concorrenti
| Azienda | Numero di frazionamenti azionari | Moltiplicatore cumulativo | Il paese |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
