LB Semicon, Inc.
061970
Classifica tra le azioni
#18897
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Prezzo delle azioni
$2.37
Capitalizzazione di mercato
$166.07M
Variazione (1 giorno)
2.60%
Variazione (1 anno)
-36.00%
Paese
KR
Scambia LB Semicon, Inc. (061970)
Categoria
Technology
Storico del prezzo dell'azione per LB Semicon, Inc. (061970)
Prezzo di chiusura più alto: $2.80 il 2026-10-01
Prezzo di chiusura più basso: $4.06 il 2011-01-01
Prezzo di chiusura più basso: $4.06 il 2011-01-01
Storico del prezzo dell'azione di LB Semicon, Inc. dal 2011 al 2026
Andamento annuale del prezzo dell'azione
| Anno | Performance |
|---|---|
| 2026 (TTM) | 9.01% |
| 2025 | 18.04% |
| 2024 | -57.42% |
| 2023 | 0.01% |
| 2022 | -48.19% |
| 2021 | 3.57% |
| 2020 | 68.25% |
| 2019 | 85.57% |
| 2018 | 28.67% |
| 2017 | 2.55% |
| 2016 | 115.84% |
| 2015 | -9.05% |
| 2014 | -28.40% |
| 2013 | -49.53% |
| 2012 | 75.42% |
| 2011 | 0.00% |
Prezzo dell'azione per aziende simili o concorrenti
| Azienda | Prezzo dell'azione | Variazione 1a% | Il paese |
|---|---|---|---|
| $221.05 | 22.61% |
US
|
|
| $73.94 | 55.79% |
TW
|
|
| $336.90 | -1.00% |
US
|
|
| $915.80 | 361.43% |
US
|
|
| $554.61 | 140.89% |
US
|
