LB Semicon, Inc.
061970
Classifica tra le azioni
#19238
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Prezzo delle azioni
$2.28
Capitalizzazione di mercato
$159.92M
Variazione (1 giorno)
-5.98%
Variazione (1 anno)
-40.84%
Paese
KR
Scambia LB Semicon, Inc. (061970)
Categoria
Technology
Storico del rendimento da dividendi per LB Semicon, Inc. (061970)
Il rendimento da dividendi (TTM) di LB Semicon, Inc. (simbolo azionario: 061970) al 2026 è: 0
Rendimento medio negli ultimi 5 anni: 0.00%
Rendimento medio negli ultimi 5 anni: 0.00%
Storico del rendimento da dividendi per LB Semicon, Inc. (061970) da 2026 a 2026
Rendimento da dividendi alla fine di ogni anno (TTM)
| Anno | Rendimento da dividendi | Cambia |
|---|---|---|
| Non abbastanza dati per le date fornite. | ||
Rendimenti da dividendi (TTM) di aziende simili o concorrenti
| Azienda | Rendimento da dividendi | Il paese |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
