HANMI Semiconductor Co., Ltd. HANMI Semiconductor Co., Ltd.

HANMI Semiconductor Co., Ltd.

042700

Classifica tra le azioni #1627
Headquartered in Incheon, South Korea, and established in 1980, HANMI... Headquartered in Incheon, South Korea, and established in 1980, HANMI Semiconductor Co., Ltd. is a global provider of advanced semiconductor manufacturing equipment, serving markets both domestically and internationally. The company's extensive product line includes specialized vision-based placement systems and a comprehensive suite of bonding solutions, such as flip chip, TSV dual stacking, TC, jumbo panel flip chip, and die flip chip bonders. HANMI also supplies comprehensive EMI shielding apparatus, encompassing vision-guided attach/detach, precise placement, tape mounting, laser cutting, demounting, and dedicated vision inspection, alongside converlay attach systems. Furthermore, their offerings extend to various testing and handling instruments like power ECU automation, test handlers, vision-enabled placement, trimming, forming, singulation, and sophisticated 3D vision inspection tools. The company manufactures diverse molding equipment, encompassing automated, compression, mechanical, and hydraulic presses. They also provide cutting-edge laser processing solutions, including general and wafer laser marking, ablation, and precise laser cutting/deflash machinery. Completing their portfolio are specialized tools such as cam press trim and form, micro cam press, CSP singulation, pick-and-place, die sorters, strip mounters, and additional testing apparatus.
Prezzo delle azioni
$139.68
Capitalizzazione di mercato
$13.25B
Variazione (1 giorno)
1.05%
Variazione (1 anno)
33.68%
Paese
KR
Scambia HANMI Semiconductor Co., Ltd. (042700)

Categoria

Technology
Storico dividendi per HANMI Semiconductor Co., Ltd. (042700)
HANMI Semiconductor Co., Ltd. (simbolo azionario: 042700) ha effettuato un totale di 22 pagamenti di dividendi.
La somma totale dei dividendi (rettificata per split azionari) è: $4.51K
Rendimento da dividendo (TTM): 0.0083
Pagamenti dei dividendi per HANMI Semiconductor Co., Ltd. (042700) dal 2005 al 2026
Pagamenti annuali dei dividendi
Anno Dividendo (rettificato per split azionari) Cambia
2026 (TTM) $800.00 -47.37%
2025 $1,520.00 261.90%
2024 $420.00 110.00%
2022 $200.00 -33.33%
2021 $300.00 50.00%
2020 $200.00 300.00%
2019 $50.00 -60.00%
2018 $125.00 4.17%
2017 $120.00 20.00%
2016 $100.00 0.00%
2015 $100.00 0.00%
2014 $100.00 0.00%
2013 $100.00 0.00%
2012 $100.00 400.00%
2011 $20.00 -80.00%
2010 $100.00 400.00%
2009 $20.00 0.00%
2008 $20.00 -33.33%
2007 $30.00 -37.00%
2006 $47.62 34.92%
2005 $35.29 0.00%
Elenco di tutti i pagamenti di dividendi
Anno Dividendo Cambia
2026 (TTM) $800.00 -47.37%
2025 $1,520.00 261.90%
2024 $420.00 110.00%
2022 $200.00 -66.67%
2021 $600.00 50.00%
2020 $400.00 300.00%
2019 $100.00 -60.00%
2018 $250.00 4.17%
2017 $240.00 -80.80%
2016 $1,250.00 0.00%
2015 $1,250.00 0.00%
2014 $1,250.00 0.00%
2013 $1,250.00 0.00%
2012 $1,250.00 400.00%
2011 $250.00 -80.00%
2010 $1,250.00 400.00%
2009 $250.00 0.00%
2008 $250.00 -36.51%
2007 $393.75 -37.00%
2006 $625.00 -16.67%
2005 $750.00 0.00%
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