BE Semiconductor Industries N.V.
BESI
Peringkat dalam Saham
#1508
BE Semiconductor Industries N.V. (BESI) specializes in the creation,... BE Semiconductor Industries N.V. (BESI) specializes in the creation, manufacturing, global distribution, and servicing of advanced machinery vital for semiconductor assembly within the electronics and chip manufacturing industries. Its extensive product portfolio features sophisticated die attach equipment, encompassing systems for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI provides a variety of packaging solutions, including conventional, ultra-thin, and wafer-level molding, alongside trim and form, and singulation systems. The company also offers plating equipment for tin, copper, precious metals, and solar applications, complete with their corresponding process chemicals. Supplemental to its core machinery, BESI supplies critical tooling, conversion kits, spare components, and various support services. With well-known brand names like Datacon, Esec, Fico, and Meco, the company primarily serves major multinational chip producers, assembly outsourcing specialists, and diverse electronics and industrial enterprises. Established in 1995, BE Semiconductor Industries N.V. maintains its headquarters in Duiven, Netherlands.
Harga Saham
$179.35
Kapitalisasi Pasar
$14.19B
Perubahan (1 hari)
-1.69%
Perubahan (1 tahun)
11.51%
Negara
NL
Perdagangan BE Semiconductor Industries N.V. (BESI)
Kategori
Technology
Riwayat dividen untuk BE Semiconductor Industries N.V. (BESI)
Saham BE Semiconductor Industries N.V. (simbol: BESI) telah membayar total 16 dividen.
Total semua dividen (disesuaikan dengan stock split): $20.86
Imbal hasil dividen (TTM): 0.01
Total semua dividen (disesuaikan dengan stock split): $20.86
Imbal hasil dividen (TTM): 0.01
Pembayaran dividen untuk BE Semiconductor Industries N.V. (BESI) dari 2011 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (disesuaikan dengan stock split) | Mengubah |
|---|---|---|
| 2026 (TTM) | $1.58 | -27.52% |
| 2025 | $2.18 | 1.40% |
| 2024 | $2.15 | -24.56% |
| 2023 | $2.85 | -14.41% |
| 2022 | $3.33 | 95.88% |
| 2021 | $1.70 | 68.32% |
| 2020 | $1.01 | -39.52% |
| 2019 | $1.67 | -28.02% |
| 2018 | $2.32 | 233.81% |
| 2017 | $0.695 | 595.00% |
| 2016 | $0.1 | -86.67% |
| 2015 | $0.75 | 354.55% |
| 2014 | $0.165 | 10.00% |
| 2013 | $0.15 | 36.36% |
| 2012 | $0.11 | 10.00% |
| 2011 | $0.1 | 0.00% |
Daftar semua pembayaran dividen
| Tahun | Dividen | Mengubah |
|---|---|---|
| 2026 (TTM) | $1.58 | -27.52% |
| 2025 | $2.18 | 1.40% |
| 2024 | $2.15 | -24.56% |
| 2023 | $2.85 | -14.41% |
| 2022 | $3.33 | 95.88% |
| 2021 | $1.70 | 68.32% |
| 2020 | $1.01 | -39.52% |
| 2019 | $1.67 | -64.01% |
| 2018 | $4.64 | 233.81% |
| 2017 | $1.39 | 595.00% |
| 2016 | $0.2 | -86.67% |
| 2015 | $1.50 | 354.55% |
| 2014 | $0.33 | 10.00% |
| 2013 | $0.3 | 36.36% |
| 2012 | $0.22 | 10.00% |
| 2011 | $0.2 | 0.00% |
Pembayaran dividen untuk perusahaan sejenis atau pesaing
| Perusahaan | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
