Hwatsing Technology Co., Ltd.
688120
Peringkat dalam Saham
#1376
Hwatsing Technology Co., Ltd. engages in the research, development, production,... Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Harga Saham
$31.17
Kapitalisasi Pasar
$15.94B
Perubahan (1 hari)
-3.19%
Perubahan (1 tahun)
119.50%
Negara
CN
Perdagangan Hwatsing Technology Co., Ltd. (688120)
Kategori
Technology
Riwayat dividen untuk Hwatsing Technology Co., Ltd. (688120)
Saham Hwatsing Technology Co., Ltd. (simbol: 688120) telah membayar total 4 dividen.
Total semua dividen (disesuaikan dengan stock split): $1.09
Imbal hasil dividen (TTM): 0.0019
Total semua dividen (disesuaikan dengan stock split): $1.09
Imbal hasil dividen (TTM): 0.0019
Pembayaran dividen untuk Hwatsing Technology Co., Ltd. (688120) dari 2023 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (disesuaikan dengan stock split) | Mengubah |
|---|---|---|
| 2026 (TTM) | $0.4 | 51.69% |
| 2025 | $0.2637 | 0.00% |
| 2024 | $0.2637 | 63.89% |
| 2023 | $0.1609 | 0.00% |
Daftar semua pembayaran dividen
| Tahun | Dividen | Mengubah |
|---|---|---|
| 2026 (TTM) | $0.56 | 51.72% |
| 2025 | $0.3691 | 0.00% |
| 2024 | $0.3691 | 63.90% |
| 2023 | $0.2252 | 0.00% |
Pembayaran dividen untuk perusahaan sejenis atau pesaing
| Perusahaan | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
