Chipbond Technology Corporation
6147
Peringkat dalam Saham
#3572
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Harga Saham
$6.41
Kapitalisasi Pasar
$4.77B
Perubahan (1 hari)
-3.36%
Perubahan (1 tahun)
237.54%
Negara
TW
Perdagangan Chipbond Technology Corporation (6147)
Kategori
Technology
Rasio P/E untuk Chipbond Technology Corporation (6147)
Rasio P/E per October 2026 TTM: 51.56
Menurut laporan keuangan dan harga saham terbaru dari Chipbond Technology Corporation, rasio P/E saat ini (TTM) adalah 51.56. Pada akhir 2023, perusahaan memiliki rasio P/E sebesar 13.36.
Riwayat rasio P/E untuk Chipbond Technology Corporation dari 2006 hingga 2026
Rasio P/E di akhir setiap tahun
| Tahun | Rasio P/E | Mengubah |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
Rasio P/E untuk perusahaan serupa atau pesaing
| Perusahaan | Rasio P/E | Perbedaan Rasio P/E | Negara |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
Bagaimana cara membaca P/E ratio?
Rasio Harga/Laba (P/E) mengukur hubungan antara harga saham perusahaan dan laba per sahamnya.
P/E yang rendah namun positif menunjukkan perusahaan dengan laba tinggi dibandingkan valuasinya saat ini dan mungkin dianggap undervalued. P/E negatif tinggi (mendekati 0) menunjukkan perusahaan yang mengalami kerugian besar.
Perusahaan dengan P/E di atas 30 atau negatif umumnya dianggap sebagai "saham pertumbuhan", artinya investor mengharapkan pertumbuhan atau keuntungan di masa depan.
Perusahaan dengan P/E positif di bawah 10 dianggap sebagai "saham bernilai", artinya perusahaan sudah sangat menguntungkan dan pertumbuhannya kemungkinan tidak besar.