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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Peringkat dalam Saham #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Harga Saham
$0.48016532
Terakhir disinkronkan: 2026-08-21
Kapitalisasi Pasar
$87.70M
Perubahan (1 hari)
1.34%
Perubahan (1 tahun)
11.79%
Negara
TW
Perdagangan Taiwan IC Packaging Corporation (3372)

Kategori

Technology
Riwayat hasil dividen untuk Taiwan IC Packaging Corporation (3372)
Hasil dividen (TTM) dari Taiwan IC Packaging Corporation (simbol saham: 3372) per 2026: 0
Rata-rata hasil dividen selama 5 tahun terakhir: 0.00%
Riwayat hasil dividen untuk Taiwan IC Packaging Corporation (3372) dari 2026 hingga 2026
Hasil dividen pada akhir setiap tahun (TTM)
Tahun Hasil Dividen Mengubah
Tidak cukup data untuk tanggal yang disediakan.
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