Kinsus Interconnect Technology Corp.
3189
Peringkat dalam Saham
#1396
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Harga Saham
$30.05
Terakhir disinkronkan: 2026-10-20
Kapitalisasi Pasar
$15.83B
Perubahan (1 hari)
-3.77%
Perubahan (1 tahun)
514.99%
Negara
TW
Perdagangan Kinsus Interconnect Technology Corp. (3189)
Kategori
Technology
Riwayat pemecahan saham untuk Kinsus Interconnect Technology Corp. (3189)
Saham Kinsus Interconnect Technology Corp. (simbol: 3189) telah mengalami total 4 kali pemecahan saham.
Pemecahan saham terbaru terjadi pada Jul 24, 2007.
Satu lembar saham 3189 yang dibeli sebelum Jul 25, 2005 sekarang setara dengan 1.46107281408 lembar saham 3189.
Pemecahan saham terbaru terjadi pada Jul 24, 2007.
Satu lembar saham 3189 yang dibeli sebelum Jul 25, 2005 sekarang setara dengan 1.46107281408 lembar saham 3189.
Daftar pemecahan saham
| Tahun | Pemecahan | Kelipatan | Kelipatan Kumulatif |
|---|---|---|---|
| 2007-07-24 | 11:10 | x1.1 | x1.46107281408 |
| 2006-08-02 | 140991:125000 | x1.127928 | x1.3282480128 |
| 2006-04-11 | 128:125 | x1.024 | x1.1776 |
| 2005-07-25 | 23:20 | x1.15 | x1.15 |
Pemecahan saham untuk perusahaan sejenis atau pesaing
| Perusahaan | Jumlah pemecahan saham | Kelipatan Kumulatif | Negara |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
