Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

3189

Peringkat dalam Saham #1394
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Harga Saham
$30.21
Kapitalisasi Pasar
$15.92B
Perubahan (1 hari)
-3.26%
Perubahan (1 tahun)
512.31%
Negara
TW
Perdagangan Kinsus Interconnect Technology Corp. (3189)

Kategori

Technology
Rasio P/E untuk Kinsus Interconnect Technology Corp. (3189)
Rasio P/E per October 2026 TTM: 169.11
Menurut laporan keuangan dan harga saham terbaru dari Kinsus Interconnect Technology Corp., rasio P/E saat ini (TTM) adalah 169.11. Pada akhir 2024, perusahaan memiliki rasio P/E sebesar 937.42.
Riwayat rasio P/E untuk Kinsus Interconnect Technology Corp. dari 2004 hingga 2026
Rasio P/E di akhir setiap tahun
Tahun Rasio P/E Mengubah
2026 (TTM) 169.11 -100.00%
2025 0.00 -100.00%
2024 937.42 -4.54%
2023 982.00 14,061.49%
2022 6.93 -71.54%
2021 24.36 -63.86%
2020 67.42 -688.43%
2019 -11.46 -120.64%
2018 55.51 11.43%
2017 49.82 246.35%
2016 14.38 37.17%
2015 10.49 -20.69%
2014 13.22 -4.82%
2013 13.89 -7.60%
2012 15.03 17.32%
2011 12.81 -28.83%
2010 18.00 -9.50%
2009 19.89 218.36%
2008 6.25 -46.61%
2007 11.70 28.44%
2006 9.11 -44.85%
2005 16.52 77.70%
2004 9.30 0.00%
Rasio P/E untuk perusahaan serupa atau pesaing
Perusahaan Rasio P/E Perbedaan Rasio P/E Negara
27.84 -83.54%
US
28.28 -83.28%
TW
42.96 -74.60%
US
12.14 -92.82%
US
144.88 -14.33%
US
Bagaimana cara membaca P/E ratio?

Rasio Harga/Laba (P/E) mengukur hubungan antara harga saham perusahaan dan laba per sahamnya.
P/E yang rendah namun positif menunjukkan perusahaan dengan laba tinggi dibandingkan valuasinya saat ini dan mungkin dianggap undervalued. P/E negatif tinggi (mendekati 0) menunjukkan perusahaan yang mengalami kerugian besar.

Perusahaan dengan P/E di atas 30 atau negatif umumnya dianggap sebagai "saham pertumbuhan", artinya investor mengharapkan pertumbuhan atau keuntungan di masa depan.

Perusahaan dengan P/E positif di bawah 10 dianggap sebagai "saham bernilai", artinya perusahaan sudah sangat menguntungkan dan pertumbuhannya kemungkinan tidak besar.