Kinsus Interconnect Technology Corp.
3189
Peringkat dalam Saham
#1362
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Harga Saham
$31.23
Kapitalisasi Pasar
$16.45B
Perubahan (1 hari)
-1.80%
Perubahan (1 tahun)
533.57%
Negara
TW
Perdagangan Kinsus Interconnect Technology Corp. (3189)
Kategori
Technology
Margin Operasi untuk Kinsus Interconnect Technology Corp. (3189)
Margin Operasi per October 2026 TTM: 9.20%
Menurut laporan keuangan dan harga saham terbaru dari Kinsus Interconnect Technology Corp., margin operasi saat ini (TTM) adalah 9.20%. Pada akhir 2024, margin operasi perusahaan adalah 3.43%.
Riwayat margin operasi untuk Kinsus Interconnect Technology Corp. dari 2004 hingga 2026
Margin Operasi pada akhir setiap tahun
| Tahun | Margin Operasi | Mengubah |
|---|---|---|
| 2026 (TTM) | 9.20% | 35.69% |
| 2025 | 6.78% | 97.67% |
| 2024 | 3.43% | -11.60% |
| 2023 | 3.88% | -82.85% |
| 2022 | 22.62% | 38.01% |
| 2021 | 16.39% | 233.13% |
| 2020 | 4.92% | -166.40% |
| 2019 | -7.41% | -320.54% |
| 2018 | 3.36% | 87.71% |
| 2017 | 1.79% | -83.99% |
| 2016 | 11.18% | -15.88% |
| 2015 | 13.29% | -17.30% |
| 2014 | 16.07% | 8.07% |
| 2013 | 14.87% | 16.99% |
| 2012 | 12.71% | 6.27% |
| 2011 | 11.96% | -26.04% |
| 2010 | 16.17% | -13.25% |
| 2009 | 18.64% | 6.64% |
| 2008 | 17.48% | -39.64% |
| 2007 | 28.96% | -12.59% |
| 2006 | 33.13% | 25.73% |
| 2005 | 26.35% | -11.10% |
| 2004 | 29.64% | 0.00% |
Margin Operasi untuk perusahaan sejenis atau pesaing
| Perusahaan | Margin Operasi | Perbedaan Margin Operasi | Negara |
|---|---|---|---|
| 65.21% | -92.91% |
US
|
|
| 56.04% | -93.91% |
TW
|
|
| 48.36% | -94.74% |
US
|
|
| 75.01% | -91.85% |
US
|
|
| 15.71% | -98.29% |
US
|
Apa itu Margin Operasi perusahaan?
Margin Operasi adalah indikator utama untuk menilai profitabilitas suatu perusahaan. Margin Operasi yang lebih tinggi umumnya lebih baik karena menunjukkan bahwa perusahaan mampu menjual produk atau layanan mereka dengan harga yang jauh lebih tinggi daripada biaya produksinya. Margin Operasi dihitung dengan membagi laba perusahaan dengan pendapatannya.