LB Semicon, Inc.
061970
Peringkat dalam Saham
#19169
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.31
Kapitalisasi Pasar
$161.86M
Perubahan (1 hari)
1.21%
Perubahan (1 tahun)
-37.84%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Riwayat pemecahan saham untuk LB Semicon, Inc. (061970)
Saham LB Semicon, Inc. (simbol: 061970) telah mengalami total 0 kali pemecahan saham.
Pemecahan saham terbaru terjadi pada Oct 21, 2026.
Satu lembar saham 061970 yang dibeli sebelum Oct 21, 2026 sekarang setara dengan 0 lembar saham 061970.
Pemecahan saham terbaru terjadi pada Oct 21, 2026.
Satu lembar saham 061970 yang dibeli sebelum Oct 21, 2026 sekarang setara dengan 0 lembar saham 061970.
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