LB Semicon, Inc.
061970
Peringkat dalam Saham
#19230
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.28
Kapitalisasi Pasar
$159.92M
Perubahan (1 hari)
-5.98%
Perubahan (1 tahun)
-40.84%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Riwayat dividen untuk LB Semicon, Inc. (061970)
Saham LB Semicon, Inc. (simbol: 061970) telah membayar total 0 dividen.
Total semua dividen (disesuaikan dengan stock split): 0.00
Imbal hasil dividen (TTM): 0
Total semua dividen (disesuaikan dengan stock split): 0.00
Imbal hasil dividen (TTM): 0
Pembayaran dividen untuk LB Semicon, Inc. (061970) dari 2026 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (disesuaikan dengan stock split) | Mengubah |
|---|---|---|
| Tidak cukup data untuk tanggal yang disediakan. | ||
Daftar semua pembayaran dividen
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|---|---|---|
| Tidak cukup data untuk tanggal yang disediakan. | ||
Pembayaran dividen untuk perusahaan sejenis atau pesaing
| Perusahaan | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 53.00% |
US
|
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| 44.00% |
TW
|
|
| 61.00% |
US
|
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| 31.00% |
US
|
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| 1.00% |
US
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