LB Semicon, Inc.
061970
Peringkat dalam Saham
#18925
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Harga Saham
$2.43
Kapitalisasi Pasar
$170.10M
Perubahan (1 hari)
-2.36%
Perubahan (1 tahun)
-36.10%
Negara
KR
Perdagangan LB Semicon, Inc. (061970)
Kategori
Technology
Kapitalisasi pasar dari LB Semicon, Inc.(061970)
Kapitalisasi Pasar: $170.10M
Per October 2026, LB Semicon, Inc. memiliki kapitalisasi pasar sebesar $170.10M. Ini menjadikan LB Semicon, Inc. sebagai perusahaan 18925th paling bernilai di dunia menurut data kami. Kapitalisasi pasar adalah nilai total saham beredar dari perusahaan publik dan biasanya digunakan untuk mengukur seberapa besar nilai sebuah perusahaan.
Riwayat kapitalisasi pasar LB Semicon, Inc. dari 2011 hingga 2026
061970 dibandingkan dengan 5 teratas stocks paling populer
