Shenzhen Techwinsemi Technology Co., Ltd.
001309
Peringkat dalam Saham
#1816
Shenzhen Techwinsemi Technology Co., Ltd. focuses its operations on the design,... Shenzhen Techwinsemi Technology Co., Ltd. focuses its operations on the design, research, development, and practical deployment of integrated circuits. The company's core activities include engineering and enhancing flash memory controller chips. Furthermore, it creates and optimizes application solutions for storage modules, which it then distributes to the market. Established in 2008, the firm is headquartered in Shenzhen, China.
Harga Saham
$36.41
Kapitalisasi Pasar
$11.56B
Perubahan (1 hari)
4.00%
Perubahan (1 tahun)
36.99%
Negara
CN
Perdagangan Shenzhen Techwinsemi Technology Co., Ltd. (001309)
Kategori
Technology
Riwayat dividen untuk Shenzhen Techwinsemi Technology Co., Ltd. (001309)
Saham Shenzhen Techwinsemi Technology Co., Ltd. (simbol: 001309) telah membayar total 5 dividen.
Total semua dividen (disesuaikan dengan stock split): $2.20
Imbal hasil dividen (TTM): 0.0073
Total semua dividen (disesuaikan dengan stock split): $2.20
Imbal hasil dividen (TTM): 0.0073
Pembayaran dividen untuk Shenzhen Techwinsemi Technology Co., Ltd. (001309) dari 2023 hingga 2026
Pembayaran dividen tahunan
| Tahun | Dividen (disesuaikan dengan stock split) | Mengubah |
|---|---|---|
| 2026 (TTM) | $1.50 | 599.95% |
| 2025 | $0.2143 | 130.68% |
| 2024 | $0.0929 | -9.63% |
| 2023 | $0.1028 | 0.00% |
Daftar semua pembayaran dividen
| Tahun | Dividen | Mengubah |
|---|---|---|
| 2026 (TTM) | $1.50 | 257.14% |
| 2025 | $0.42 | 130.77% |
| 2024 | $0.182 | -30.51% |
| 2023 | $0.2619 | 0.00% |
Pembayaran dividen untuk perusahaan sejenis atau pesaing
| Perusahaan | Jumlah pembayaran dividen | Negara |
|---|---|---|
| 56.00% |
US
|
|
| 46.00% |
TW
|
|
| 64.00% |
US
|
|
| 34.00% |
US
|
|
| 2.00% |
US
|
