Chipbond Technology Corporation Chipbond Technology Corporation

Chipbond Technology Corporation

6147

Helyezés a részvények között #3583
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Részvényárfolyam
$6.41
Piaci kapitalizáció
$4.77B
Változás (1 nap)
-3.36%
Változás (1 év)
237.54%
Ország
TW
Kereskedés Chipbond Technology Corporation (6147)

Kategória

Technology
Részvényfelosztások története: Chipbond Technology Corporation (6147)
Chipbond Technology Corporation részvény (szimbólum: 6147) összesen 3 részvényfelosztáson ment keresztül.
A legutóbbi felosztás dátuma: Aug 05, 2008.
Egy 6147 részvény, amelyet a(z) Aug 08, 2006 előtt vásároltak, ma 1.0891166688 6147 részvénynek felel meg.
Részvényfelosztások listája
Év Felosztás Szorzó Halmozott szorzó
2008-08-05 25569:25000 x1.02276 x1.0891166688
2007-08-07 51:50 x1.02 x1.06488
2006-08-08 261:250 x1.044 x1.044
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