Chipbond Technology Corporation
6147
Helyezés a részvények között
#3429
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Részvényárfolyam
$6.79
Piaci kapitalizáció
$5.06B
Változás (1 nap)
5.96%
Változás (1 év)
255.05%
Ország
TW
Kereskedés Chipbond Technology Corporation (6147)
Kategória
Technology
Bevétel a(z) Chipbond Technology Corporation (6147) részvényhez
Bevétel ekkor: Jun 2026 TTM: $741.76M
Chipbond Technology Corporation legfrissebb pénzügyi jelentései szerint a vállalat jelenlegi árbevétele (TTM) $741.76M. 2023 évben a vállalat $653.65M árbevételt ért el, amely csökkenés a 2022 évben elért $783.04M árbevételhez képest. Az árbevétel az a teljes összeg, amit a vállalat termékek vagy szolgáltatások eladásából generál. A nyereséggel ellentétben ebből nem vonódnak le költségek.
Chipbond Technology Corporation bevételtörténete 2006 és 2026 között
Bevétel az év végén
| Év | Bevétel | Változtassa meg |
|---|---|---|
| 2026 (TTM) | $741.76M | 19.71% |
| 2024 | $619.63M | -5.20% |
| 2023 | $653.65M | -16.52% |
| 2022 | $783.04M | -19.86% |
| 2021 | $977.09M | 23.23% |
| 2020 | $792.89M | 16.15% |
| 2019 | $682.63M | 11.48% |
| 2018 | $612.33M | -1.44% |
| 2017 | $621.29M | 16.79% |
| 2016 | $531.99M | 3.84% |
| 2015 | $512.34M | -8.12% |
| 2014 | $557.60M | 5.32% |
| 2013 | $529.42M | 2.44% |
| 2012 | $516.83M | 18.35% |
| 2011 | $436.69M | 1.03% |
| 2010 | $432.22M | 165.22% |
| 2009 | $162.97M | 1.62% |
| 2008 | $160.37M | -11.21% |
| 2007 | $180.62M | 42.48% |
| 2006 | $126.77M | 0.00% |
Hasonló cégek vagy versenytársak bevétele
| Vállalat | Bevétel | Bevételkülönbség | Ország |
|---|---|---|---|
| $302.97B | 40,744.68% |
US
|
|
| $141.20B | 18,936.29% |
TW
|
|
| $89.10B | 11,912.53% |
US
|
|
| $133.19B | 17,855.70% |
US
|
|
| $41.31B | 5,468.52% |
US
|
