Hwatsing Technology Co., Ltd. Hwatsing Technology Co., Ltd.

Hwatsing Technology Co., Ltd.

688120

Classement en actions #1376
Hwatsing Technology Co., Ltd. engages in the research, development, production,... Hwatsing Technology Co., Ltd. engages in the research, development, production, sales, and technical services of semiconductor equipment in China and internationally. The company offers chemical mechanical polishers, implanters, grinders, bevel polishers, dicers, wet process and film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Prix de l'action
$31.17
Capitalisation boursière
$15.94B
Changement (1 jour)
-3.19%
Changement (1 an)
119.50%
Pays
CN
Échange Hwatsing Technology Co., Ltd. (688120)

Catégorie

Technology
Historique des dividendes pour Hwatsing Technology Co., Ltd. (688120)
Hwatsing Technology Co., Ltd. (symbole boursier : 688120) a versé un total de 4 dividendes.
Le total des dividendes (ajusté en fonction des divisions d’actions) est de : $1.09
Rendement du dividende (TTM) : 0.0019
Versements de dividendes pour Hwatsing Technology Co., Ltd. (688120) de 2023 à 2026
Versements annuels de dividendes
Année Dividende (ajusté pour divisions d’actions) Changez
2026 (TTM) $0.4 51.69%
2025 $0.2637 0.00%
2024 $0.2637 63.89%
2023 $0.1609 0.00%
Liste de tous les paiements de dividendes
Année Dividende Changez
2026 (TTM) $0.56 51.72%
2025 $0.3691 0.00%
2024 $0.3691 63.90%
2023 $0.2252 0.00%
Dividendes versés par des entreprises similaires ou concurrentes