Chipbond Technology Corporation
6147
Classement en actions
#3572
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Prix de l'action
$6.41
Capitalisation boursière
$4.77B
Changement (1 jour)
-3.36%
Changement (1 an)
237.54%
Pays
TW
Échange Chipbond Technology Corporation (6147)
Catégorie
Technology
Ratio P/E pour Chipbond Technology Corporation (6147)
Ratio P/E au October 2026 TTM : 51.56
Selon les derniers rapports financiers et le cours de l'action de Chipbond Technology Corporation, le ratio P/E actuel (TTM) est de 51.56. À la fin de l’année 2023, le P/E de l’entreprise était de 13.36.
Historique du ratio P/E pour Chipbond Technology Corporation de 2006 à 2026
Ratio P/E à la fin de chaque année
| Année | Ratio P/E | Changez |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
Ratio P/E pour des entreprises similaires ou concurrentes
| Entreprise | P/E Ratio | Différence du P/E Ratio | Pays |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
Comment lire un P/E ratio ?
Le ratio Prix/Bénéfice (P/E Ratio) mesure la relation entre le cours de l'action d'une entreprise et ses bénéfices par action.
Un P/E bas mais positif indique une entreprise qui génère des bénéfices élevés par rapport à sa valorisation et qui pourrait être sous-évaluée. Un P/E négatif élevé (proche de 0) indique des pertes importantes.
Les entreprises avec un P/E supérieur à 30 ou négatif sont généralement considérées comme des "actions de croissance", ce qui signifie que les investisseurs s'attendent à ce qu'elles se développent ou deviennent rentables.
Les entreprises avec un P/E positif inférieur à 10 sont généralement considérées comme des "actions de valeur", car elles sont déjà très rentables mais avec peu de potentiel de croissance.