Chipbond Technology Corporation
6147
Classement en actions
#3500
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Prix de l'action
$6.61
Dernière synchronisation: 2026-10-16
Capitalisation boursière
$4.92B
Changement (1 jour)
-2.12%
Changement (1 an)
253.64%
Pays
TW
Échange Chipbond Technology Corporation (6147)
Catégorie
Technology
Marge opérationnelle de Chipbond Technology Corporation (6147)
Marge opérationnelle au October 2026 TTM : 13.60%
Selon les derniers rapports financiers et le cours de l'action de Chipbond Technology Corporation, la marge opérationnelle actuelle (TTM) est de 13.60%. À la fin de 2023, elle était de 16.58%.
Historique de la marge opérationnelle pour Chipbond Technology Corporation de 2006 à 2026
Marge opérationnelle à la fin de chaque année
| Année | Marge opérationnelle | Changez |
|---|---|---|
| 2026 (TTM) | 13.60% | 8.80% |
| 2024 | 12.50% | -24.61% |
| 2023 | 16.58% | -48.40% |
| 2022 | 32.13% | 16.37% |
| 2021 | 27.61% | 36.82% |
| 2020 | 20.18% | -22.53% |
| 2019 | 26.05% | 25.06% |
| 2018 | 20.83% | 20.40% |
| 2017 | 17.30% | 7.79% |
| 2016 | 16.05% | 6.22% |
| 2015 | 15.11% | -10.96% |
| 2014 | 16.97% | -0.82% |
| 2013 | 17.11% | -20.53% |
| 2012 | 21.53% | 29.00% |
| 2011 | 16.69% | -28.03% |
| 2010 | 23.19% | 192.80% |
| 2009 | 7.92% | 28.57% |
| 2008 | 6.16% | -69.18% |
| 2007 | 19.99% | 30.82% |
| 2006 | 15.28% | 0.00% |
Marge opérationnelle pour des entreprises similaires ou concurrentes
| Entreprise | Marge opérationnelle | Différence de Marge Opérationnelle | Pays |
|---|---|---|---|
| 65.21% | -95.21% |
US
|
|
| 56.04% | -95.88% |
TW
|
|
| 48.36% | -96.44% |
US
|
|
| 75.01% | -94.48% |
US
|
|
| 15.71% | -98.84% |
US
|
Qu'est-ce que la Marge opérationnelle d'une entreprise ?
La Marge opérationnelle est un indicateur clé pour évaluer la rentabilité d'une entreprise. Une marge d'exploitation plus élevée est généralement préférable car elle montre qu'une entreprise peut vendre ses produits ou services bien au-dessus de leurs coûts de production. Elle se calcule en divisant les bénéfices par le chiffre d'affaires.