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3s Silicon Tech., Inc. 3s Silicon Tech., Inc.

3s Silicon Tech., Inc.

5297
Classement en actions #22755
3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu,... 3s Silicon Tech., Inc., established in 1998 and headquartered in Hsinchu, Taiwan, specializes in providing die bonding solutions for discrete power devices to customers both locally and globally. Their comprehensive product line includes advanced clip die bonders for power devices, which incorporate functionalities such as clip attachment and precise pick-and-place capabilities. The company also offers a diverse range of snap ovens, encompassing standard models, units with vacuum reflow processes, formic acid reflow ovens, and flux eutectic reflow ovens, alongside complete power module assembly automation solutions. Additionally, 3s Silicon Tech. engineers custom automation equipment tailored for both power device and power discrete assembly. Clients can also utilize their open lab platform for thorough product and fabrication process verification.
Prix de l'action
$2.23
Dernière synchronisation: 2026-08-21
Capitalisation boursière
$83.81M
Changement (1 jour)
-0.57%
Changement (1 an)
130.82%
Pays
TW
Échange 3s Silicon Tech., Inc. (5297)

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Historique du rendement du dividende pour 3s Silicon Tech., Inc. (5297)
Le rendement du dividende (TTM) de 3s Silicon Tech., Inc. (symbole boursier : 5297) au 2026 est : 0
Rendement moyen du dividende sur les 5 dernières années : 0.00%
Historique du rendement du dividende de 3s Silicon Tech., Inc. (5297) de 2026 à 2026
Rendement du dividende à la fin de chaque année (TTM)
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