HPSP Co., Ltd. HPSP Co., Ltd.

HPSP Co., Ltd.

403870

Classement en actions #5065
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Prix de l'action
$34.99
Capitalisation boursière
$2.85B
Changement (1 jour)
1.20%
Changement (1 an)
39.35%
Pays
KR
Échange HPSP Co., Ltd. (403870)

Catégorie

Technology
Ratio P/B pour HPSP Co., Ltd. (403870)
Ratio P/B au October 2026 TTM : 12.93
Selon les derniers rapports financiers et le cours de l'action de HPSP Co., Ltd., le ratio cours/valeur comptable actuel (TTM) est 12.93. À la fin de 2023, le ratio P/B était de 12.58.
Historique du ratio P/B pour HPSP Co., Ltd. de 2018 à 2026
Ratio P/B à la fin de chaque année
Année Ratio P/B Changez
2026 (TTM) 12.93 68.80%
2024 7.66 -39.12%
2023 12.58 126.82%
2022 5.55 -65.75%
2021 16.19 -34.80%
2020 24.84 -40.97%
2019 42.07 -40.27%
2018 70.44 0.00%
Ratio P/B pour des entreprises similaires ou concurrentes
Entreprise Ratio P/B Différence de Ratio P/B Pays
23.3783 80.81%
US
9.8357 -23.93%
TW
16.5536 28.02%
US
7.4648 -42.27%
US
13.8493 7.11%
US