HPSP Co., Ltd. HPSP Co., Ltd.

HPSP Co., Ltd.

403870

Classement en actions #5111
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Prix de l'action
$35.96
Capitalisation boursière
$2.93B
Changement (1 jour)
4.00%
Changement (1 an)
43.20%
Pays
KR
Échange HPSP Co., Ltd. (403870)

Catégorie

Technology
Historique des dividendes pour HPSP Co., Ltd. (403870)
HPSP Co., Ltd. (symbole boursier : 403870) a versé un total de 4 dividendes.
Le total des dividendes (ajusté en fonction des divisions d’actions) est de : $937.50
Rendement du dividende (TTM) : 0.012
Versements de dividendes pour HPSP Co., Ltd. (403870) de 2022 à 2026
Versements annuels de dividendes
Année Dividende (ajusté pour divisions d’actions) Changez
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -75.00%
2022 $150.00 0.00%
Liste de tous les paiements de dividendes
Année Dividende Changez
2026 (TTM) $600.00 0.00%
2025 $600.00 300.00%
2024 $150.00 300.00%
2023 $37.50 -93.75%
2022 $600.00 0.00%
Dividendes versés par des entreprises similaires ou concurrentes