HPSP Co., Ltd.
403870
Classement en actions
#5024
HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales... HPSP Co., Ltd. is an enterprise engaged in the manufacturing and global sales of specialized high-pressure annealing equipment for the semiconductor industry, serving markets in South Korea and worldwide. Its product lineup encompasses the GENI-SYS, an advanced high-pressure thermal processing unit, alongside the GENI high-pressure thermal processing system, and the GENI-SE, which is designed for high-pressure oxidation applications. Furthermore, the company provides comprehensive support services such as the supply of spare parts, repair and exchange programs for components, assistance with installation, and ongoing technical guidance. Established in 2005, HPSP Co., Ltd. operates from its headquarters in Suwon, South Korea.
Prix de l'action
$35.61
Capitalisation boursière
$2.90B
Changement (1 jour)
3.00%
Changement (1 an)
41.83%
Pays
KR
Échange HPSP Co., Ltd. (403870)
Catégorie
Technology
Historique du rendement du dividende pour HPSP Co., Ltd. (403870)
Le rendement du dividende (TTM) de HPSP Co., Ltd. (symbole boursier : 403870) au 2023-12-31 est : 0.05%
Rendement moyen du dividende sur les 5 dernières années : 0.95%
Rendement moyen du dividende sur les 5 dernières années : 0.95%
Historique du rendement du dividende de HPSP Co., Ltd. (403870) de 2018 à 2026
Rendement du dividende à la fin de chaque année (TTM)
| Année | Rendement du dividende | Changez |
|---|---|---|
| 2026 (TTM) | 1.20% | 242.86% |
| 2024 | 0.35% | 600.00% |
| 2023 | 0.05% | -95.54% |
| 2022 | 1.12% | -52.14% |
| 2021 | 2.34% | 162.92% |
| 2020 | 0.89% | 8,800.00% |
| 2019 | 0.01% | -98.75% |
| 2018 | 0.80% | 0.00% |
Rendements du dividende (TTM) pour des entreprises similaires ou concurrentes
| Entreprise | Rendement du dividende | Pays |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
