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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Classement en actions #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Prix de l'action
$0.48016532
Dernière synchronisation: 2026-08-21
Capitalisation boursière
$87.70M
Changement (1 jour)
1.34%
Changement (1 an)
11.79%
Pays
TW
Échange Taiwan IC Packaging Corporation (3372)

Catégorie

Historique des divisions d’actions pour Taiwan IC Packaging Corporation (3372)
L’action Taiwan IC Packaging Corporation (symbole : 3372) a subi un total de 0 divisions.
La division la plus récente a eu lieu le Aug 23, 2026.
Une action 3372 achetée avant le Aug 23, 2026 équivaudrait aujourd’hui à 0 actions 3372.
Liste des divisions d’actions
Année Division Multiplicateur Multiplicateur cumulatif
Pas assez de données pour les dates fournies.
Divisions d’actions d’entreprises similaires ou concurrentes
Entreprise Nombre de divisions d’actions Multiplicateur cumulatif Pays
6 x480
US
11 x12
TW
1 x10
US
3 x10
US
1 x0
KR