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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Classement en actions #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Prix de l'action
$0.48016532
Dernière synchronisation: 2026-08-21
Capitalisation boursière
$87.70M
Changement (1 jour)
1.34%
Changement (1 an)
11.79%
Pays
TW
Échange Taiwan IC Packaging Corporation (3372)

Catégorie

Technology
Historique des dividendes pour Taiwan IC Packaging Corporation (3372)
Taiwan IC Packaging Corporation (symbole boursier : 3372) a versé un total de 0 dividendes.
Le total des dividendes (ajusté en fonction des divisions d’actions) est de : 0.00
Rendement du dividende (TTM) : 0
Versements de dividendes pour Taiwan IC Packaging Corporation (3372) de 2026 à 2026
Versements annuels de dividendes
Année Dividende (ajusté pour divisions d’actions) Changez
Pas assez de données pour les dates fournies.
Liste de tous les paiements de dividendes
Année Dividende Changez
Pas assez de données pour les dates fournies.
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