Kinsus Interconnect Technology Corp.
3189
Classement en actions
#1329
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Prix de l'action
$31.96
Capitalisation boursière
$16.84B
Changement (1 jour)
6.35%
Changement (1 an)
554.04%
Pays
TW
Échange Kinsus Interconnect Technology Corp. (3189)
Catégorie
Technology
Historique des divisions d’actions pour Kinsus Interconnect Technology Corp. (3189)
L’action Kinsus Interconnect Technology Corp. (symbole : 3189) a subi un total de 4 divisions.
La division la plus récente a eu lieu le Jul 24, 2007.
Une action 3189 achetée avant le Jul 25, 2005 équivaudrait aujourd’hui à 1.46107281408 actions 3189.
La division la plus récente a eu lieu le Jul 24, 2007.
Une action 3189 achetée avant le Jul 25, 2005 équivaudrait aujourd’hui à 1.46107281408 actions 3189.
Liste des divisions d’actions
| Année | Division | Multiplicateur | Multiplicateur cumulatif |
|---|---|---|---|
| 2007-07-24 | 11:10 | x1.1 | x1.46107281408 |
| 2006-08-02 | 140991:125000 | x1.127928 | x1.3282480128 |
| 2006-04-11 | 128:125 | x1.024 | x1.1776 |
| 2005-07-25 | 23:20 | x1.15 | x1.15 |
Divisions d’actions d’entreprises similaires ou concurrentes
| Entreprise | Nombre de divisions d’actions | Multiplicateur cumulatif | Pays |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
