Winbond Electronics Corporation
2344
Classement en actions
#1067
Winbond Electronics Corporation is a global enterprise specializing in the... Winbond Electronics Corporation is a global enterprise specializing in the entire lifecycle of very large scale integration (VLSI) integrated circuits (ICs). This encompasses the design, development, manufacturing, and worldwide distribution of these components for a broad spectrum of microelectronic applications across Asia, the Americas, and Europe. The company organizes its operations into three primary product divisions: DRAM IC, Flash Memory, and Logic IC products. Its extensive portfolio features a diverse range of Dynamic Random-Access Memory (DRAM) devices. For mobile uses, these include pseudo static RAM (SRAM), HyperRAM, various low-power synchronous DRAM (SDR SDRAM), and double-data-rate (DDR) SDRAM standards (such as DDR1, DDR2, DDR3, and DDR4/4X), along with Known Good Die (KGD) formats. Furthermore, Winbond offers specialty DRAM units like standard SDRAM, DDR, DDR2, and DDR3 SDRAM, also available as KGD. In the realm of flash memory, the company provides solutions specifically for code storage, which consist of serial NOR flash, QspiNAND Flash, Single-Level Cell (SLC) NAND Flash, NAND-Based Multi-Chip Packages (MCP), SpiStack Flash NAND, and TrustME secure flash memory. Additionally, Winbond supplies a selection of logic integrated circuits. These sophisticated semiconductor components are integral to numerous high-technology sectors. Their widespread applications span computing, telecommunications, and general consumer electronics, extending to critical automotive and industrial control systems. They are also crucial for contemporary personal devices like smartphones, tablets, low-power mobile handhelds, and wearable technology, as well as the burgeoning Internet of Things (IoT). Further uses include powering personal computers and their associated peripherals, modules for mobile handheld devices, network communication equipment, and household appliance control units. Winbond markets its products through an established network of distributors and directly via online channels. Beyond its core manufacturing and sales, the company is deeply involved in comprehensive research, development, and design activities, providing dedicated post-sales support for its semiconductor and 6-inch wafer products. The corporation also operates in e-commerce, offers specialized testing services, serves as an Original Equipment Manufacturer (OEM), provides computer software services, and delivers expert consulting. Moreover, it includes a wholesale division for computer hardware, accessories, and software, in addition to handling project-specific sales. Established in 1987, Winbond Electronics Corporation maintains its principal corporate office in Taichung, Taiwan.
Prix de l'action
$4.85
Dernière synchronisation: 2026-10-20
Capitalisation boursière
$21.82B
Changement (1 jour)
-1.93%
Changement (1 an)
233.78%
Pays
TW
Échange Winbond Electronics Corporation (2344)
Catégorie
Technology
Historique des divisions d’actions pour Winbond Electronics Corporation (2344)
L’action Winbond Electronics Corporation (symbole : 2344) a subi un total de 3 divisions.
La division la plus récente a eu lieu le Oct 31, 2017.
Une action 2344 achetée avant le May 24, 2000 équivaudrait aujourd’hui à 1.3423674 actions 2344.
La division la plus récente a eu lieu le Oct 31, 2017.
Une action 2344 achetée avant le May 24, 2000 équivaudrait aujourd’hui à 1.3423674 actions 2344.
Liste des divisions d’actions
| Année | Division | Multiplicateur | Multiplicateur cumulatif |
|---|---|---|---|
| 2017-10-31 | 253:250 | x1.012 | x1.3423674 |
| 2001-05-15 | 239:200 | x1.195 | x1.32645 |
| 2000-05-24 | 111:100 | x1.11 | x1.11 |
Divisions d’actions d’entreprises similaires ou concurrentes
| Entreprise | Nombre de divisions d’actions | Multiplicateur cumulatif | Pays |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
