LB Semicon, Inc.
061970
Classement en actions
#19117
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Prix de l'action
$2.31
Capitalisation boursière
$161.86M
Changement (1 jour)
1.21%
Changement (1 an)
-37.84%
Pays
KR
Échange LB Semicon, Inc. (061970)
Catégorie
Technology
Historique des divisions d’actions pour LB Semicon, Inc. (061970)
L’action LB Semicon, Inc. (symbole : 061970) a subi un total de 0 divisions.
La division la plus récente a eu lieu le Oct 21, 2026.
Une action 061970 achetée avant le Oct 21, 2026 équivaudrait aujourd’hui à 0 actions 061970.
La division la plus récente a eu lieu le Oct 21, 2026.
Une action 061970 achetée avant le Oct 21, 2026 équivaudrait aujourd’hui à 0 actions 061970.
Liste des divisions d’actions
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Divisions d’actions d’entreprises similaires ou concurrentes
| Entreprise | Nombre de divisions d’actions | Multiplicateur cumulatif | Pays |
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| 6 | x480 |
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| 11 | x12 |
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| 1 | x10 |
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| 3 | x10 |
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| 6 | x26 |
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