LB Semicon, Inc. LB Semicon, Inc.

LB Semicon, Inc.

061970

Classement en actions #19234
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Prix de l'action
$2.28
Capitalisation boursière
$159.92M
Changement (1 jour)
-5.98%
Changement (1 an)
-40.84%
Pays
KR
Échange LB Semicon, Inc. (061970)

Catégorie

Technology
Historique des dividendes pour LB Semicon, Inc. (061970)
LB Semicon, Inc. (symbole boursier : 061970) a versé un total de 0 dividendes.
Le total des dividendes (ajusté en fonction des divisions d’actions) est de : 0.00
Rendement du dividende (TTM) : 0
Versements de dividendes pour LB Semicon, Inc. (061970) de 2026 à 2026
Versements annuels de dividendes
Année Dividende (ajusté pour divisions d’actions) Changez
Pas assez de données pour les dates fournies.
Liste de tous les paiements de dividendes
Année Dividende Changez
Pas assez de données pour les dates fournies.
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