LB Semicon, Inc.
061970
Classement en actions
#19236
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Prix de l'action
$2.28
Capitalisation boursière
$159.92M
Changement (1 jour)
-5.98%
Changement (1 an)
-40.84%
Pays
KR
Échange LB Semicon, Inc. (061970)
Catégorie
Technology
Historique du rendement du dividende pour LB Semicon, Inc. (061970)
Le rendement du dividende (TTM) de LB Semicon, Inc. (symbole boursier : 061970) au 2026 est : 0
Rendement moyen du dividende sur les 5 dernières années : 0.00%
Rendement moyen du dividende sur les 5 dernières années : 0.00%
Historique du rendement du dividende de LB Semicon, Inc. (061970) de 2026 à 2026
Rendement du dividende à la fin de chaque année (TTM)
| Année | Rendement du dividende | Changez |
|---|---|---|
| Pas assez de données pour les dates fournies. | ||
Rendements du dividende (TTM) pour des entreprises similaires ou concurrentes
| Entreprise | Rendement du dividende | Pays |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
