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Smilek to the Bank Smilek to the Bank
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Moneda
USD
Tema
Solvvy Inc. Solvvy Inc.

Solvvy Inc.

7320
Clasificación en acciones #21469
Headquartered in Tokyo, Japan, Solvvy Inc. was founded in 2009 and specializes... Headquartered in Tokyo, Japan, Solvvy Inc. was founded in 2009 and specializes in offering comprehensive warranty services alongside a suite of Software-as-a-Service (SaaS) products. Their extensive service portfolio encompasses various guarantees and support, including coverage for home appliances, long-term building structures, earthquake damage, and pre-owned residences, as well as ground compensation and maintenance fund accumulation. Solvvy also provides essential inspection, upkeep, repair, and customer contact center services, augmented by expert system development consulting. On the technology front, the company develops and markets several SaaS platforms such as Home Manager, Home BOT, Genba Assist, KROX, and My Class. Demonstrating a commitment to innovation, Solvvy Inc. is also venturing into new product and service development within the renewable energy and educational information and communication technology (ICT) sectors. Furthermore, the company diversified its operations to include financial solutions like factoring, escrow, valuation, and facilitating individual credit purchases. Notably, the firm underwent a name change from Japan Living Warranty Inc. to Solvvy Inc. in November 2024.
Precio por acción
$9.49
Última sincronización: 2026-08-21
Capitalización bursátil
$106.56M
Cambio (1 día)
1.61%
Cambio (1 año)
-39.13%
País
JP
Comercio Solvvy Inc. (7320)

Categoría

Technology
Historial de rendimiento por dividendo de Solvvy Inc. (7320)
Rendimiento por dividendo (TTM) de Solvvy Inc. (símbolo bursátil: 7320) al 2026: 0
Rendimiento promedio por dividendo de los últimos 5 años: 0.00%
Historial de rendimiento por dividendo de Solvvy Inc. (7320) desde 2026 hasta 2026
Rendimiento por dividendo al final de cada año (TTM)
Año Rendimiento por dividendo Cambiar
Not enough data for the provided dates.
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