Chipbond Technology Corporation
6147
Clasificación en acciones
#3544
Chipbond Technology Corporation, along with its affiliated entities,... Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.
Precio por acción
$6.50
Capitalización bursátil
$4.84B
Cambio (1 día)
-1.92%
Cambio (1 año)
242.56%
País
TW
Comercio Chipbond Technology Corporation (6147)
Categoría
Technology
Ratio P/E de Chipbond Technology Corporation (6147)
Ratio P/E al October 2026 TTM: 51.56
Según los últimos informes financieros y el precio de las acciones de Chipbond Technology Corporation, el P/E actual (TTM) de la empresa es 51.56. Al final de 2023, la empresa tenía un P/E de 13.36.
Historial del ratio P/E de Chipbond Technology Corporation desde 2006 hasta 2026
Relación P/E al final de cada año
| Año | Ratio P/E | Cambiar |
|---|---|---|
| 2026 (TTM) | 51.56 | 347.59% |
| 2024 | 11.52 | -13.82% |
| 2023 | 13.36 | 95.69% |
| 2022 | 6.83 | -7.87% |
| 2021 | 7.41 | -37.42% |
| 2020 | 11.84 | 10.67% |
| 2019 | 10.70 | 20.12% |
| 2018 | 8.91 | -45.16% |
| 2017 | 16.25 | 8.49% |
| 2016 | 14.98 | 0.42% |
| 2015 | 14.91 | 1.59% |
| 2014 | 14.68 | 29.69% |
| 2013 | 11.32 | -15.69% |
| 2012 | 13.43 | 36.83% |
| 2011 | 9.81 | -12.17% |
| 2010 | 11.17 | -57.79% |
| 2009 | 26.46 | -23.76% |
| 2008 | 34.71 | 280.23% |
| 2007 | 9.13 | -25.74% |
| 2006 | 12.29 | 0.00% |
Relación P/E para empresas similares o competidores
| Empresa | P/E Ratio | Diferencia del P/E Ratio | País |
|---|---|---|---|
| 27.84 | -46.01% |
US
|
|
| 28.28 | -45.15% |
TW
|
|
| 42.96 | -16.69% |
US
|
|
| 12.14 | -76.46% |
US
|
|
| 144.88 | 180.98% |
US
|
¿Cómo leer un P/E ratio?
El ratio Precio/Beneficio (P/E Ratio) mide la relación entre el precio de las acciones de una empresa y sus beneficios por acción.
Un P/E bajo pero positivo indica una empresa con altos beneficios en relación a su valoración actual y que podría estar infravalorada. Una empresa con un P/E negativo alto (cerca de 0) indica fuertes pérdidas en comparación con su valoración.
Las empresas con un P/E superior a 30 o negativo suelen considerarse "acciones de crecimiento", lo que significa que los inversores esperan que crezca o se vuelva rentable en el futuro.
Las empresas con un P/E positivo inferior a 10 suelen considerarse "acciones de valor", lo que significa que ya son muy rentables y no se espera un fuerte crecimiento.