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Taiwan IC Packaging Corporation Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation

3372
Clasificación en acciones #22494
Taiwan IC Packaging Corporation is dedicated to developing advanced integrated... Taiwan IC Packaging Corporation is dedicated to developing advanced integrated circuit (IC) packaging technologies, particularly focusing on optical and ultra-slim designs. Its extensive product catalog features a wide array of IC package types, including thin small outline (TSOP), small outline (SOP), SSOP/TSSOP, quad flat no-lead (QFN)/dual flat no-lead (DFN), thin PKG, TQFP, quad flat (QFP), LQFP, thermally enhanced versions, and specialized image sensor packages. Beyond these, the firm also offers substrate-based packaging solutions like LGA, VLGA, and packaging for micro-SD and SD cards. Founded in 1998, the company is headquartered in Kaohsiung, Taiwan.
Precio por acción
$0.48016532
Última sincronización: 2026-08-21
Capitalización bursátil
$87.70M
Cambio (1 día)
1.34%
Cambio (1 año)
11.79%
País
TW
Comercio Taiwan IC Packaging Corporation (3372)

Categoría

Technology
Ratio P/S de Taiwan IC Packaging Corporation (3372)
Ratio P/S al 2026 TTM: 0
Según los informes financieros más recientes y el precio de las acciones de Taiwan IC Packaging Corporation, el ratio P/S actual (TTM) es 0. Al final de 2026, el ratio P/S era 0.
Historial del ratio P/S de Taiwan IC Packaging Corporation desde 2026 hasta 2026
Ratio P/S al final de cada año
Año Ratio P/S Cambiar
Not enough data for the provided dates.
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