Kinsus Interconnect Technology Corp.
3189
Clasificación en acciones
#1334
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Precio por acción
$31.96
Capitalización bursátil
$16.84B
Cambio (1 día)
6.35%
Cambio (1 año)
554.04%
País
TW
Comercio Kinsus Interconnect Technology Corp. (3189)
Categoría
Technology
Historial de desdoblamientos de acciones de Kinsus Interconnect Technology Corp. (3189)
La acción Kinsus Interconnect Technology Corp. (símbolo: 3189) tuvo un total de 4 desdoblamientos.
El desdoblamiento más reciente ocurrió el Jul 24, 2007.
Una acción 3189 comprada antes de Jul 25, 2005 equivaldría hoy a 1.46107281408 acciones 3189.
El desdoblamiento más reciente ocurrió el Jul 24, 2007.
Una acción 3189 comprada antes de Jul 25, 2005 equivaldría hoy a 1.46107281408 acciones 3189.
Lista de desdoblamientos de acciones
| Año | Desdoblamiento | Multiplicador | Multiplicador acumulado |
|---|---|---|---|
| 2007-07-24 | 11:10 | x1.1 | x1.46107281408 |
| 2006-08-02 | 140991:125000 | x1.127928 | x1.3282480128 |
| 2006-04-11 | 128:125 | x1.024 | x1.1776 |
| 2005-07-25 | 23:20 | x1.15 | x1.15 |
Desdoblamientos de acciones de empresas similares o competidoras
| Empresa | Número de desdoblamientos de acciones | Multiplicador acumulado | País |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
|
| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
