LB Semicon, Inc.
061970
Clasificación en acciones
#19124
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Precio por acción
$2.34
Capitalización bursátil
$163.80M
Cambio (1 día)
2.42%
Cambio (1 año)
-37.10%
País
KR
Comercio LB Semicon, Inc. (061970)
Categoría
Technology
Ratio P/S de LB Semicon, Inc. (061970)
Ratio P/S al 2026 TTM: 0
Según los informes financieros más recientes y el precio de las acciones de LB Semicon, Inc., el ratio P/S actual (TTM) es 0. Al final de 2026, el ratio P/S era 0.
Historial del ratio P/S de LB Semicon, Inc. desde 2026 hasta 2026
Ratio P/S al final de cada año
| Año | Ratio P/S | Cambiar |
|---|---|---|
| Not enough data for the provided dates. | ||
Ratio P/S de empresas similares o competidoras
| Empresa | Ratio P/S | Diferencia del ratio P/S | País |
|---|---|---|---|
| 17.60 | - |
US
|
|
| 14.25 | - |
TW
|
|
| 18.55 | - |
US
|
|
| 7.75 | - |
US
|
|
| 22.53 | - |
US
|
