LB Semicon, Inc.
061970
Clasificación en acciones
#19239
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Precio por acción
$2.28
Capitalización bursátil
$159.92M
Cambio (1 día)
-5.98%
Cambio (1 año)
-40.84%
País
KR
Comercio LB Semicon, Inc. (061970)
Categoría
Technology
Historial de dividendos de LB Semicon, Inc. (061970)
LB Semicon, Inc. (símbolo bursátil: 061970) realizó un total de 0 pagos de dividendos.
La suma de todos los dividendos (ajustados por splits de acciones) es: 0.00
Rentabilidad por dividendo (TTM): 0
La suma de todos los dividendos (ajustados por splits de acciones) es: 0.00
Rentabilidad por dividendo (TTM): 0
Pagos de dividendos de LB Semicon, Inc. (061970) desde 2026 hasta 2026
Pagos anuales de dividendos
| Año | Dividendo (ajustado por splits de acciones) | Cambiar |
|---|---|---|
| Not enough data for the provided dates. | ||
Lista de todos los pagos de dividendos
| Año | Dividendo | Cambiar |
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| Not enough data for the provided dates. | ||
Pagos de dividendos de empresas similares o competidoras
| Empresa | Número de pagos de dividendos | País |
|---|---|---|
| 53.00% |
US
|
|
| 44.00% |
TW
|
|
| 61.00% |
US
|
|
| 31.00% |
US
|
|
| 1.00% |
US
|
