LB Semicon, Inc.
061970
Clasificación en acciones
#19230
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South... LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Precio por acción
$2.35
Capitalización bursátil
$164.52M
Cambio (1 día)
2.88%
Cambio (1 año)
-36.82%
País
KR
Comercio LB Semicon, Inc. (061970)
Categoría
Technology
Historial de rendimiento por dividendo de LB Semicon, Inc. (061970)
Rendimiento por dividendo (TTM) de LB Semicon, Inc. (símbolo bursátil: 061970) al 2026: 0
Rendimiento promedio por dividendo de los últimos 5 años: 0.00%
Rendimiento promedio por dividendo de los últimos 5 años: 0.00%
Historial de rendimiento por dividendo de LB Semicon, Inc. (061970) desde 2026 hasta 2026
Rendimiento por dividendo al final de cada año (TTM)
| Año | Rendimiento por dividendo | Cambiar |
|---|---|---|
| Not enough data for the provided dates. | ||
Rendimientos por dividendo (TTM) de empresas similares o competidoras
| Empresa | Rendimiento por dividendo | País |
|---|---|---|
| 0.23% |
US
|
|
| 0.98% |
TW
|
|
| 0.75% |
US
|
|
| 0.06% |
US
|
|
| 0.00% |
US
|
