Kinsus Interconnect Technology Corp.
3189
Κατάταξη σε μετοχές
#1318
Kinsus Interconnect Technology Corp., together with its subsidiaries, engages... Kinsus Interconnect Technology Corp., together with its subsidiaries, engages in the manufacture and sale of electronic products in Taiwan and internationally. It operates through the IC Substrate and Optics segments. The company offers system in package substrate, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for multi-chip module, multi-chip package, stack die, package in package, and embedded substrates, as well as modules in handset and wearable devices. It also provides plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. In addition, the company offers wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and Wi-Fi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company is involved in the manufacture and sale of medical equipment; research, development, manufacture, production, and sale of printed circuit boards, electronic components, and related products, as well as provision of after-sales services; and sale of cosmetic products. Further, it is involved in the wholesale and retail-sale of electronic materials; provision of business operation and management consultation services; production, manufacture, and sale of contact lenses; and investment and trading activities. The company was incorporated in 2000 and is based in Taoyuan City, Taiwan.
Τιμή μετοχής
$31.96
Κεφαλαιοποίηση
$16.84B
Αλλαγή (1 ημέρα)
6.35%
Αλλαγή (1 έτος)
554.04%
Χώρα
TW
Εμπόριο Kinsus Interconnect Technology Corp. (3189)
Κατηγορία
Technology
Ιστορικό διασπάσεων μετοχών για Kinsus Interconnect Technology Corp. (3189)
Η μετοχή Kinsus Interconnect Technology Corp. (σύμβολο: 3189) υπέστη συνολικά 4 διασπάσεις.
Η πιο πρόσφατη διάσπαση πραγματοποιήθηκε στις Jul 24, 2007.
Μία μετοχή 3189 που αγοράστηκε πριν τις Jul 25, 2005 ισοδυναμεί σήμερα με 1.46107281408 μετοχές 3189.
Η πιο πρόσφατη διάσπαση πραγματοποιήθηκε στις Jul 24, 2007.
Μία μετοχή 3189 που αγοράστηκε πριν τις Jul 25, 2005 ισοδυναμεί σήμερα με 1.46107281408 μετοχές 3189.
Λίστα διασπάσεων μετοχών
| Έτος | Διάσπαση | Πολλαπλασιαστής | Αθροιστικός Πολλαπλασιαστής |
|---|---|---|---|
| 2007-07-24 | 11:10 | x1.1 | x1.46107281408 |
| 2006-08-02 | 140991:125000 | x1.127928 | x1.3282480128 |
| 2006-04-11 | 128:125 | x1.024 | x1.1776 |
| 2005-07-25 | 23:20 | x1.15 | x1.15 |
Διασπάσεις μετοχών για παρόμοιες εταιρείες ή ανταγωνιστές
| Εταιρεία | Αριθμός διασπάσεων μετοχών | Αθροιστικός Πολλαπλασιαστής | Χώρα |
|---|---|---|---|
| 6 | x480 |
US
|
|
| 11 | x12 |
TW
|
|
| 1 | x10 |
US
|
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| 3 | x10 |
US
|
|
| 6 | x26 |
US
|
